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电磁无源贴片式蜂鸣器BM5018STZ讯响器图1电磁无源贴片式蜂鸣器BM5018STZ讯响器图2电磁无源贴片式蜂鸣器BM5018STZ讯响器图3

电磁无源贴片式蜂鸣器BM5018STZ讯响器

2017-03-16 10:20207
价格 6.00
发货 广东广州市
该产品库存不足
产品详情
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技术规格

产品测试条件:温度:5~35℃,湿度:45%~85%R.H.,气压:860~1060hPa。

标准测试条件:温度:25±3℃,湿度:60±10%R.H. 气压:860~1060hPa。

 

1

额定电压

3.0 Vo-p

2

工作电压

2.0~4.0 Vo-p

3

额定电流

Max.100mA ,(在方波3Vp-p 4KHz占空比为50%时)

4

在10cm处输出音压

Min. 75dB,(在方波3Vp-p 4KHz占空比为50%时)

5

电阻

12±3Ω

6

谐振频率

4000Hz

7

工作温度

-30℃~+70℃

8

储存温度

-40℃~+85℃

9

净重

Approx 0.1g

10

环保

Yes

1.   尺寸图

Unit: mm

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*基本公差:除特殊注明外,一般公差为±0.3mm

*外壳:黑色LCP  铜盖

*焊盘: 3个焊盘,镀锡铜

         

 

 

 

2.   Electrical And Acoustical Measuring Condition

Recommended Driving Circuit

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Resonant frequency, 1/2 duty cycle. Square wave.

Signal amplitude should be large enough tosaturate

the transistor.

Recommended Setting

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3.   Frequency Response

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3.0Vo-p 50% duty Square wave,10cm

 

 

4.   Surface mounting condition

5.1 Reflow soldering

Recommendable reflow soldering condition is as follows.

3

 

Note:(1) In automated mounting of the SMD sound transducers on PCB, any bending, expanding

and pulling forces or shocks against the SMD sound transducers shall be kept minimum

to prevent them from electrical failures and mechanical damages of the devices.

(2) In the reflow soldering, too high soldering temperatures and too large temperature

      Gradient such as rapid heating or cooling may cause electrical failures and mechanical

damages of the devices.

5.2 Soldering pattern

 
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5.   ReliabilityTest

After any following tests the part shall meet specifications without any degradation in

appearance and performance except SPL. SPL shall not deviate more than -10 dB

from the initial value

6.1  Ordinary Temperature Life Test

The part shall be subjected to 96 hours at 25±10℃. Input rated voltage

Resonant frequency, 1/2 duty Square wave.

6.2  High Temperature Test

The part shall be capable of with standing a storage temperature of +85℃for 96 hours.

6.3  Low Temperature Test

The part shall be capable of with standing a storage temperature of --40℃for 96 hours.

6.4 Humidity Test

Temperature:+40℃±3℃   Relative Humidity:90%~95% Duration: 48 hours

and expose to room temperature for 6 hours

6.5 Temperature Shock Test

Temperature:60℃/1hour→25℃/3hours→-20℃/1hour→25℃/3hours (1cycle)

Total cycle: 10 cycles

6.6 Drop Test

Standard Packaging From 75cm(Drop on hard wood or board of 5cm thick,

three sides, six plain.)

6.7 Vibration Test

Vibration:1000cycles /min. Amplitude:1.5mm, Duration: 1 hour in each 3 axes

6.8 Reflow Test

Userecommendable reflow soldering condition (as shown in 5.1)

(1) No abnormality should be found after reflow

(2) Good soldering to meet soldering requirements

 

 

Note:

As this product is not protected from foreign material entering, please make sure that any foreign materials (e.g. magnetic powder, washing solvent, flux, corrosive gas) do not enter this product in your production processes. The functional degradation (e.g. SPL down) may occur if foreign material enter it.

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