| 1. 技术规格 产品测试条件：温度：5～35℃，湿度：45%～85%R.H.，气压：860～1060hPa。 标准测试条件：温度：25±3℃,湿度：60±10%R.H. 气压：860～1060hPa。 |
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1 |
额定电压 |
3Vo-p |
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2 |
工作电压 |
2～4 Vo-p |
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3 |
额定电流 |
Max.50mA , (在方波3Vp-p 2731Hz占空比为50%时) |
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4 |
在10cm处输出音压 |
Min. 90dB, (在方波3Vp-p 2731Hz占空比为50%时) |
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5 |
电阻 |
25±5Ω |
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6 |
谐振频率 |
2731Hz |
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7 |
工作温度 |
-30℃～+70℃ |
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8 |
储存温度 |
-40℃～+85℃ |
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9 |
净重 |
Approx 0.8g |
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10 |
环保 |
Yes |
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| 2.尺寸图 |
Unit: mm |
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*基本公差:除特殊注明外，一般公差为±0.3mm *外壳材质:黑色LCP *焊盘: 2个焊盘,镀锡铜 |
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| 3. Electrical And Acoustical Measuring Condition | |
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Recommended Driving Circuit Resonant frequency, 1/2 duty cycle. Square wave. Signal amplitude should be large enough tosaturate the transistor. |
Recommended Setting
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| 4.Frequency Response 2.8Vo-p 50% duty Square wave,10cm |
| 5.Surface mounting condition 5.1 Reflow soldering Recommendable reflow soldering condition is as follows.
Note:(1) In automated mounting of the SMD sound transducers on PCB, any bending, expanding and pulling forces or shocks against the SMD sound transducers shall be kept minimum to prevent them from electrical failures and mechanical damages of the devices. (2) In the reflow soldering, too high soldering temperatures and too large temperature Gradient such as rapid heating or cooling may cause electrical failures and mechanical damages of the devices. |
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5.2 Soldering pattern |
