8050单指向咪头驻极体传声器抗干扰双电容咪芯背极式电容咪头

承認書

SPECIFICATION FOR APPROVAL

东莞市音领袖电子有限公司

工厂地址：东莞市长安镇增田恒泰路4号2楼

TEL：400-1140041 FAX：+86-769-85643930

E-mail：voicelerder@126.com

TYPE：ECM

PART No：BU8050L-473

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1.Scope

The specifications should be applied to electret condenser microphone of BU8050L-473

2.Storage And Judgement Conditions

3.Specifications

Test Conditions：VS=1.5V，RL=680Ω,Temp=20±2°C, R.H=60±5%????

4.Frequency Response

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PART No：BU8050L-473

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TYPE：ECM

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6.Test Circuit

7.Test Setup Drawing

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8. Reliability Test

All tests should be done after 2 hours of conditioning at 20℃,R.H65% ,while the sensitivity is to be within ±3dB from the initial sensitivity after the following experiments.

8.1 High Temperature Test

High temperature:+85℃

Duration:72 hours

8.2 Low Temperature Test

Low temperature: -40℃

Duration: 72 hours

8.3 Temperature Cycle Test (See in Fig.1)

Low temperature: -25℃

High temperature: +85℃

Changeover time: 24hours

Duration: 24hours

Cycle: 32

8.4 Statical Humidity Test

Temperature: +60℃

Relative humidity: 90～95%

Duration: 72hours

TYPE：ECM

PART No：BU8050L-473

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8.5 Vibration Test

Amplitude : 1.52mm

Duration: 1minutes /plane

Freq.range: 10～55 Hz

Total time: 2 hours

8.6 Dropping Test

Drop a unit unpacked onto a board of 20mm thick.

Height: 1.0 m

Cycle: 6

8.7 ESD Test

The microphone under test must be discharged between each ESD exposure without ground.

(contact:±6KV,air:±8KV)There is no interference in operationafter 10 times exposure.

9. Regarding the Soldering operation

a. Use 15~ 20W soldering iron and maintain 290℃~310℃ in operation.

b. Operators who work in the solder fixture and the soldering iron must be statically groundedunder eachsoldering process.

C. Soldering should be accomplished within two seconds at each terminal so

as not to be overheated.

d . Optimal design for heat sink pad is same as below.

TYPE：ECM

PART No：BU8050L-473

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TYPE：ECM

PART No：BU8050L-473

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1、Assembly process

a)、After connector and holder are once disassembled , they should not be re-used.

b)、Do not touch outer springs directly(except for PCB or proper terminal set at nominal height.

c)、Do not give any mechanical shocks to the micphone(e.g. dropping to floor)

2、General information

2-1:This microphone shall not be operated or stored in following

environment.

>where liquid(water,solvent and so on)splashes.

>where the air has a high concentration of corrosive gas .

>where is too dusty.

>where temperature changes rapidly.

2-2: Frequency response especially in high frequency region is dependent on the structure of enclosure.

Please remove additional acoustic mass or cavity in front of the microphone to the utmost.

2-3:do not put mechanical pressure more than 2 kg to the microphone.

2-4: microphone should not be in state of outgoing packing for a long-term storage.

2-5: all the soldering procedures upon microphone must be complete in a metallic device,the temperature of the soldering irons must be limited as 320℃ and less 3 s ,the operators、the solder fixtures and the soldering irons must be statically grounded under each soldering process.

产品简介

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